深亚PCB|PCB中常用的100个英文缩写、全称及中文名

    对于刚进入PCB行业，许多英文缩写就像天书，让人晦涩难懂，因此深亚电子整理了100个PCB中常用的英文缩写、全称及中文名供大家学习：

1.PCB - Printed Circuit Board - 印刷电路板
2.SMT - Surface Mount Technology - 表面贴装技术
3.BGA - Ball Grid Array - 球栅阵列
4.DFM - Design for Manufacturability - 可制造性设计
5.DFT - Design for Testability - 可测试性设计
6.EMI - Electromagnetic Interference - 电磁干扰
7.EMC - Electromagnetic Compatibility - 电磁兼容性
8.HAL - Hot Air Leveling - 热风熔锡
9.HASL - Hot Air Solder Leveling - 热风焊锡平整
10.ICT - In-Circuit Test - 板级测试
11.FCT - Functional Circuit Test - 功能电路测试
12.AOI - Automated Optical Inspection - 自动光学检测
13.X-ray - X-ray Inspection - X射线检测
14.ESD - Electrostatic Discharge - 静电放电
15.LED - Light Emitting Diode - 发光二极管
16.BOM - Bill Of Materials - 物料清单
17.CAD - Computer-Aided Design - 计算机辅助设计
18.CAM - Computer-Aided Manufacturing - 计算机辅助制造
19.CNC - Computer Numerical Control - 计算机数控
20.ROHS - Restriction of Hazardous Substances - 有害物质限制
21.NRE - Non-Recurring Engineering - 非重复工程
22.PTH - Plated Through-Hole - 过孔
23.THT - Through-Hole Technology - 穿孔技术
24.MCPCB - Metal Core Printed Circuit Board - 金属基板印刷电路板
25.HDI - High Density Interconnect - 高密度互连
26.OSP - Organic Solderability Preservatives - 有机钎焊保护剂
27.RF - Radio Frequency - 射频
28.Vias - Vertical Interconnect Access - 垂直互连孔
29.LVDS - Low Voltage Differential Signaling - 低压差分信号传输
30.EDA - Electronic Design Automation - 电子设计自动化
31.FPC - Flexible Printed Circuit - 柔性印刷电路板
32.IPC - Institute for Printed Circuits - 印制电路协会
33.LGA - Land Grid Array - 焊盘阵列
34.MCM - Multi-Chip Module - 多芯片模块
35.DDR - Double Data Rate - 双倍数据传输率
36.RAM - Random Access Memory - 随机存取存储器
37.ROM - Read-Only Memory - 只读存储器
38.TDR - Time Domain Reflectometry - 时域反射法
39.DRC - Design Rule Check - 设计规则检查
40.VRM - Voltage Regulator Module - 电压调节模块
41.PBC - Polychlorinated Biphenyls - 多氯联苯
42.PWM - Pulse Width Modulation - 脉宽调制
43.LPI - Liquid Photo-Imageable - 液体感光油墨
44.ERP - Enterprise Resource Planning - 企业资源规划
45.CRM - Customer Relationship Management - 客户关系管理
46.CAD/CAM - Computer-Aided Design/Computer-Aided Manufacturing - 计算机辅助设计/制造
47.DIP - Dual In-line Package - 双列直插封装
48.IC - Integrated Circuit - 集成电路
49.FPGA - Field Programmable Gate Array - 现场可编程门阵列
50.ASIC - Application-Specific Integrated Circuit - 特定应用集成电路
51.RD - Research and Development - 研发
52.EDA - Electronic Design Automation - 电子设计自动化
53.CEM - Contract Electronics Manufacturer - 合同电子制造商
54.PWB - Printed Wiring Board - 印刷布线板
55.P&P - Pick and Place - 取放设备
56.SMD - Surface Mount Device - 表面贴装器件
57.MSL - Moisture Sensitivity Level - 湿敏等级
58.OEE - Overall Equipment Effectiveness - 设备综合效率
59.RFQ - Request for Quotation - 报价请求
60.PMS - Process Management System - 过程管理系统
61.ESD - Electrostatic Discharge - 静电释放
62.PNP - Positive-Negative-Positive - 正负正结构
63.SPC - Statistical Process Control - 统计过程控制
64.SMTA - Surface Mount Technology Association - 表面贴装技术协会
65.UL - Underwriters Laboratories - 安捷伦实验室
66.WIP - Work in Progress - 在制品
67.COB - Chip on Board - 芯片贴片
68.DIP - Dual Inline Pin - 双列直插引脚
69.FIFO - First In, First Out - 先进先出
70.GND - Ground - 地线
71.IPQC - In-Process Quality Control - 过程中的质量控制
72.LCR - Leadless Chip Resistor - 无引线片式电阻
73.MTBF - Mean Time Between Failures - 故障平均时间间隔
74.NPI - New Product Introduction - 新产品导入
75.PCBA - Printed Circuit Board Assembly - 印刷电路板组装
76.PPM - Parts Per Million - 百万分之一
77.QFN - Quad Flat No-Leads - 方形无引脚封装
78.RMA - Return Merchandise Authorization - 退货授权
79.SPC - Statistical Process Control - 统计过程控制
80.THT - Through-Hole Technology - 穿孔技术
81.TRM - Technical Reference Manual - 技术参考手册
82.UPS - Uninterruptible Power Supply - 不间断电源
83.VPP - Verification and Production Prototype - 验证和生产原型
84.WEEE - Waste Electrical and Electronic Equipment - 废弃电子电器设备
85.PPF - Process Performance Factor - 工艺性能因子
86.PNP - Positive-Negative-Positive - 正-负-正结构
87.UUT - Unit Under Test - 被测单元
88.ZIF - Zero Insertion Force - 零插入力
89.Cpk - Process Capability Index - 过程能力指数
90.CP - Control Plan - 控制计划
91.FMEA - Failure Mode and Effects Analysis - 失效模式和效应分析
92.Gage R&R - Gauge Repeatability and Reproducibility - 量具重复性和再现性
93.LCA - Life Cycle Assessment - 生命周期评估
94.SMT - Surface Mount Technology - 表面贴装技术
95.DFT - Design for Testability - 可测试性设计
96.CEM - Contract Electronics Manufacturer - 合同电子制造商
97.BOM - Bill Of Materials - 物料清单
98.COB - Chip on Board - 芯片贴片
99.FMEA - Failure Mode and Effects Analysis - 失效模式和效应分析
100.LCA - Life Cycle Assessment - 生命周期评估

        以上是深亚电子整理的一些在 PCB 领域中常见的英文缩写及其全称，希望对你有所帮助。 

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